Original MECHANIC Solder Paste Soldering Tin Cream For PCB BGA SMD 35gm (XG-50)

EGP250.00

In stock

Category:

EGP250.00

Description

Features:

Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on Good soldering and welding tool

Specification:

Material: Plastic+solder paste

Type: XG-50

Alloy: Sn63/Pb37

Microns: 3#

Weight : 35gm

Application:

Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.

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Original MECHANIC Solder Paste Soldering Tin Cream For PCB BGA SMD 35gm (XG-50)

EGP250.00

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